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High Precision Automatic CCD Hole Punching Machine for Electronic Materials
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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High-End CCD Automatic Guide Hole Punching Machine For Membrane Switches/Graphic Overlays/Flexible Circuits
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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CCD Automatic Guide Hole Punching Machine for Electronic Materials
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Precision CCD Guide Hole Punching Machine for Graphic Overlays Nameplates
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Automatic CCD Guide Hole Punching Machine For Fiducial Marks
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Fully Automatic CCD Guide Hole Punching Machine For Medical Glucose Strips
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Fully Automatic CCD Guide Hole Punching Machine For HMI Panels/Membrane Switches
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Fully Automatic CCD Guide Hole Punching Machine For Graphic Overlays with Auto Feeding & Unloading
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Fully Automatic Guide Hole Punching Machine For HMI Manufacturing
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Top Sales Automatic CCD Hole Punching Machine for Printed Marking
Material Of Punch Die: SKD11/61 Quenched
Punch Die Service Life: 1-5 Million Cycles
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SLTJ-5080 Automatic CCD Registration Printed Mark Hole Punching Machine
Material Of Punch Die: SKD11/61 Quenched
Punch Die Service Life: 1-5 Million Cycles
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Industrial Auto CCD Hole Punching Machine With Reliable Performance
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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AUTO GUIDE HOLE PUNCHING MACHINE
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Sheet-to-Sheet CCD Target Hole Punching Machine
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Fully Automatic CCD Positioning Hole Punching Machine for Precision Nameplate(thin film)
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
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Top Sales Stable Automatic CCD Target Precision Hole Punch Machine For Fiducial Marks
Material Of Punch Die: SKD11/61 Quenched
Substrate Thickness: 0.075-1.5mm(base On Material)
