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High Precision ±0.015mm Automatic CCD Guide Hole Punching Machine with Rapid Cycle Time 0.5s and SKD11/61 Quenched Punch Die

High Precision ±0.015mm Automatic CCD Guide Hole Punching Machine with Rapid Cycle Time 0.5s and SKD11/61 Quenched Punch Die

high precision automatic hole punch machine

CCD guide hole punch for polycarbonate

automatic gaming label hole punch

Luogo di origine:

Cina

Marca:

SILITRON

Certificazione:

CE

Numero di modello:

SLTJ-5040

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Dettagli del prodotto
Materiale del pugno:
SKD11/61 estinto
Spessore del substrato:
0,075-1,5 mm (base sul materiale)
Colore:
Grigio
Precisione:
±0.015mm
Evidenziare:

high precision automatic hole punch machine

,

CCD guide hole punch for polycarbonate

,

automatic gaming label hole punch

Termini di pagamento e di spedizione
Quantità di ordine minimo
1
Imballaggi particolari
L1800mm x W1600mm x H1450mm
Termini di pagamento
T/T
Capacità di alimentazione
30 set al mese
Descrizione del prodotto

Application


It's widely used for PET, PC, PVC, IMI/IMD, flexible circuits, films, photoplates, polyester, mobile phone panels, mobile phone keypads, aluminum substrates, thin aluminum sheets, nameplates, polycarbonate, membrane switches, decals, vehecle panel, keyboards, dials, demos, heat transfer label, front panel, flex printed circuits, medical labels, graphic overlays, self-adhesive label, membrane keyboard, and other thin materials.

 

Punching Samples


High Precision ±0.015mm Automatic CCD Guide Hole Punching Machine with Rapid Cycle Time 0.5s and SKD11/61 Quenched Punch Die 0

 

Product Features


  1. Automated Punching System – Eliminates manual adjustment with CCD vision positioning.
  2. Rapid Cycle Time – 0.5 seconds per hole boosts productivity up to 3× semi-auto methods.
  3. Micron-Level Accuracy – Maintains punching error within ±0.015 mm.
  4. Touchscreen Operation – Human-machine interface simplifies control and workflow setup.
  5. Stable Punching – Clamping system flattens substrates during operation.
  6. Specialized Lighting – Reliable recognition even on reflective or complex surfaces.
  7. Live Punching Display – Watch the process on a large 19-inch computer screen.
  8. Supports Difficult Materials – Works on films, semi-printed circles, and mirror-finish substrates.
  9. Robust Processing Software – Binary image analysis guarantees recognition consistency.
  10. Long-Term Support – System allows lifetime upgrades with strong technical assistance.

 

Technical Parameters


 

Model SLTJ-5040

Hole diameter

Φ1 mm-Φ5mm(customizable)

Max material size

500*400mm

Max punching force

7kN

Multiple light sources

white & colors

Punching precision

±0.015mm

Material thickness

0.1-1.2mm(depend on material)

Punching speed

0.35s/hole(exclude loading & unloading time)

Power

1.5KW

Voltage

AC200V~240V

Dimension

L1620mm x W1420mm x H1300mm

Weight

550kg

Storage height

200 mm

 

Workable Marks

High Precision ±0.015mm Automatic CCD Guide Hole Punching Machine with Rapid Cycle Time 0.5s and SKD11/61 Quenched Punch Die 1 High Precision ±0.015mm Automatic CCD Guide Hole Punching Machine with Rapid Cycle Time 0.5s and SKD11/61 Quenched Punch Die 2

 

Main Components


  • Transmission components: motor, lead screw, guide rail, slider, coupling, bearing, limit photoelectric switch, metal connecting plate.
  • Pneumatic components: solenoid valve, cylinder, oil–water filter, punching die, control relay.
  • Vision components: video capture card, camera, lens, infrared light source, touchscreen display.
  • Control components: industrial PC, motion control card, SLT automatic punching software, camera auto-positioning calculation system, relay on/off control system.
  • Electrical components: AC–DC power supply, short-circuit protection air switch, driver, solenoid valve.

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